ultrasonic bonding

Study on Interfacial Characteristics and Resistance of Electronic Device during Ultrasonic Bonding

电子器件超声键合接合部形成特征及电性能研究

These results will be helpful for optimization of the ultrasonic bonding transducer.

这些结论有助于超声键合换能系统的优化。

Study on Process Model of Ultrasonic Bonding

超声焊接的研究和工艺模型

Development of Control System Used in Ultrasonic Al Wire Bonding Machine

超声波铝线自动邦定机控制系统的研制

In this paper, a four-layer chip was proposed and then bonded using thermal assisted ultrasonic bonding method; later the bonding results were also tested.

本文设计了一种四层结构芯片，利用热辅助超声波键合方法完成了四层芯片微流控器件的键合，并对键合结果进行测试。

Design of ultrasonic bonding systems based on mass customization

大规模定制下超声波焊接系统的设计

Research on Ultrasonic Bonding to Thick Film An Conductor

厚膜Au导体的超声键合技术研究

Mechanism and Reliability of Lead Free Joints Fabricated by Low Temperature Ultrasonic Bonding

无铅焊点低温超声互连的机理及可靠性研究

The control software for ultrasonic bonding machine is indispensable for the automatic production-lines run by manufactories making microcircuit chips.

超声波焊接机控制软件是国内外生产微电路芯片厂家自动化流水线的不可缺少的一部分。

Research on the Ultrasonic Bonding Method for Polymer Microfluidic Chips

聚合物微流控芯片超声波键合方法研究